Materials
PROCESS CHEMICAL
Product List
| Product line | Product |
|---|---|
| Developer | TMAH-based mixture and nBA,TMAH/KOH Mixtures |
| Etchant | BOE, Nitride etchant, Cu Etchant, Ti Etchant, Si Etchant |
| Stripper | Bump(Positive/Negative PR), CMOS image Sensor, LED potive/negative, S(Rework) |
| Thinner | PGMEA, PGME Solvent mixtures and PGMEA/ nBA mixtures |
| Cleaner | Cu post etch residue remover, Cu pCMP cleaner |
| Primer | PR primer |
| CMP Slurry | Carbon CMP Slurry, W CMP Slurry |
| Bulk Chmical(Cleaning, Etching) | 34%/40% NH₄F, 40%/50% HF, 29% NH₄OH |